The SEMICON China 2023, Shanghai International Semiconductor Exhibition, bringing together global industry leaders, was grandly held on June 29, 2023, at the Shanghai New International Expo Center. MTM showcased a wide array of packaging samples and cutting-edge technological solutions, including MCU, power modules, domestically-produced Chiplet-GPU chips with super large dimensions, and in-vehicle MEMS pressure sensors. Gathering alongside heavyweight semiconductor technology pioneers from around the world in Shanghai, they shared the latest and hottest technological achievements, focused on market trends, and grasped the pulse of the industry.

SEMICON China 2023, Shanghai International Semiconductor Exhibition, covered a total area of 90,000 square meters, with more than 1,100 semiconductor exhibitors and over 4,200 booths. The event brought together elites from the domestic and international semiconductor industry, providing a lively and bustling atmosphere where ideas and strategies were shared to contribute to the development of China's semiconductor industry.

As a leading enterprise in advanced packaging design, multi-physics domain simulation, and one-stop SiP advanced packaging and testing services, MTM has been focusing on high-performance chips and high-density packaging applications since its establishment in 2020. MTM has continuously provided top-quality packaging solutions for global customers in areas such as GPU/CPU/DPU/NPU, MCU, AI chips, wearables, smart healthcare, the Internet of Things, and new energy, with a strong emphasis on design and mass production. During this exhibition, MTM's booth attracted a constant stream of clients, with its multi-physics domain simulation and one-stop SiP advanced packaging and testing technologies drawing high popularity from customers worldwide.

The semiconductor industry, as a strategically emerging field strongly encouraged and supported by the country, is a focal point in the new wave of technological and industrial revolutions, garnering significant attention from the market. In the current context, the development of China's semiconductor industry faces unprecedented challenges and opportunities. MTM is rapidly expanding and investing heavily to achieve full-scale mass production in the semiconductor packaging and testing industry, contributing to the development of China's semiconductor industry.

With a new starting point, the future of chips is promising. MTM will undoubtedly remain steadfast in providing internationally leading solutions in advanced packaging design, multi-physics domain simulation, and one-stop SiP advanced packaging and testing. MTM actively engages in collaborative innovation within the industry chain, forming a cooperative innovation environment that involves close cooperation between industry, academia, and research institutions, enabling the high-level advancement of industry foundations and product mass production. Guided by the belief of surpassing Moore's Law and creating the future, MTM is committed to facilitating the rapid development of the semiconductor industry. This exhibition was a complete success, and we look forward to meeting you again in the future!